2016贴片晶振尺寸2.0*1.6小型化石英晶振封装，适用于设计空间有限的智能手机，最小化的天线模块设备，智能锁等其它消费类产品。此产品特点：金属外壳，高可性焊缝焊接包装，超轻，超小型频率范围宽。
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Item |
Standard specifications |
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Frequency Range F0 |
16to 18.999MHz |
19 to 24.999MHz |
25 to 29.999MHz |
30 to 62.500MHz |
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Mode of Vibration |
Fundamental |
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Load Capacitance CL |
8 to 16pF |
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Frequency Tolerance △F/ F0 |
±10ppm, ±15ppm,±30ppm(At 25℃) |
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Equivalent Series Resistance ESR |
200 Ωmax. |
100Ω max. |
80Ω max. |
60Ω max. |
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Temperature Stability TC |
±10ppm,±15ppm,±30ppm(Refer to 25℃) |
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Operating Temperature Range TOPR |
-20~+70℃ -40~+85℃ Option |
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Storage Temperature Range TSTG |
-55~+125℃ |
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Shunt Capacitance C0 |
3pF max. |
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Insulator Resistance IR |
500MΩ min. (At 100V) |
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Drive Level DL |
50µW (100µW max.) |
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Aging Fa |
±2ppm max. (At 25℃, First year) |
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Packing Unit |
3000pcs/reel |
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